Primed for Power Experience Primal performance with the Prime Radeon™ RX 9070 graphics card featuring a compact 2.5-slot design for expansive compatibility, enhanced by a phase-change GPU thermal pad and a triple-fan setup for supreme cooling.

ASUS Dual Radeon™ RX 7600 OC Edition 8GB GDDR6 optimized inside and out for lower temps and durability OC mode: Up to 2745 MHz (Boost Clock)/up to 2340 MHz (Game Clock) Axial-tech fan design features a smaller fan hub to increase airflow through the cooling array. Dual ball fan bearings can last up to twice as long as sleeve bearing designs 2.5-slot design allows for greater build compatibility while maintaining premium cooling 0dB technology lets you enjoy light gaming in relative silence Auto-extreme precision automated manufacturing for higher reliability A stainless steel bracket is harder and more resistant to corrosion GPU Tweak III software provides intuitive performance tweaking, thermal controls, and system monitoring

Honeywell PTM7950 TIM The Honeywell PTM7950 Thermal Interface Material (TIM) offers a premium solution for high-performance electronics, particularly in the demanding field of graphics processing units (GPUs). The PTM7950 delivers superior thermal conductivity, enhancing the reliability and longevity of graphics cards by its outstanding material characteristics The Free Flow cooling design is tailored for axial fan systems, featuring an advanced heatsink fin module that optimizes airflow paths. By reducing turbulence and channeling air efficiently, it maximizes heat dissipation, ensuring consistent performance even under heavy thermal loads The latest fan blade design builds upon its predecessor with advancements that reduce air friction, increasing the usable fan RPM range while maintaining low noise levels. This refined design ensures improved airflow, optimized static pressure, and enhanced cooling efficiency for demanding applications The composite heatpipes are fine-tuned for each individual cooling design with optimal heat flow, efficiently and evenly spreading out the heat to the entire cooling module Integrated Cooling is an advanced thermal management solution engineered to provide efficient heat dissipation across all critical components of a graphics card. This innovative design ensures direct contact with the GPU, memory modules, and VRMs, delivering uniform thermal regulation. By addressing all major heat sources, the Integrated Cooling Module helps maintain stable operating temperatures, improving overall system performance and reliability. Ideal for demanding workloads such as gaming, content creation, and overclocking, it ensures optimal thermal efficiency under sustained use The all-aluminum backplate provides additional rigidity that guarantees nothing bends and dust stays out. It also helps cool your card by increasing heat dissipation The mechanical design of the graphics card features a robust, box-like frame that ensures exceptional build quality and durability. This solid construction provides a protective enclosure for all internal components, reducing the risk of damage during handling or installation. This rigid frame offers added stability and strength, making it highly resistant to accidental impacts or pressure, ensuring that the delicate components, such as the GPU, memory, and VRMs, remain secure. With this design, users can confidently handle the card without worrying about compromising its integrity or performance In order to protect your card, the SAPPHIRE cards have fuse protection built into the circuit of the external PCI-E power connector to keep the components safe The GPU is mounted on to the high-density 10 layer 2oz Copper and high TG PCB to match the rapid speed, high current and increased power requirement of the GPU and memory to guarantee high stability of the PCB during operation